29 days old

Semiconductor Packaging Engineer

Pacific Biosciences
Menlo Park, CA 94025
Semiconductor Packaging Engineer



Pacific Biosciences is looking for a Semiconductor Packaging Engineer ready to work on our next-generation biologically integrated semiconductor chip sequencing technology. This position will involve working in a fast-moving cross-discipline environment. This person will work very closely with external manufacturing partners and will represent the company for specific product lines. Daily job activities will include overseeing foundry assembly and packaging of integrated CMOS devices utilizing die level and die to wafer level bonding, bonding of injection molded plastic parts and ceramic substrates, wafer dicing, and wire bonding, all while having the unique opportunity of interfacing with a multidisciplinary team of scientists and engineers.



The ideal candidate is an adaptive forward-thinking person able to take ownership of complex long-range projects while executing on immediate short term deliverables. Key skills will include complex problem solving, team management, statistical design and analysis, superb documentation skills, and excellent team interaction. Hands on experience with CMOS packaging design, UV and thermal adhesives, die and wire bonding will make for a highly successful candidate.



Responsibilities:



  • Ensuring high quality electrical packaging of integrated CMOS and fluidics products utilizing external foundry partners and for the improvement and ramp into high volume of processes, tools, designs, and materials.

  • Integration of a standard CMOS component with injection molded plastics utilizing both standard and custom packaging techniques.

  • Management of foundry/external manufacturing vendors.

  • Proactive assessment of risks/failure modes and ownership of excursions.

  • Coordinate with Quality team to both improve and resolve issues related to product quality

  • Roadmapping and implementation of CIP projects to effect positive change in cost/quality/cycle time/functional performance.

  • Application of SPC/FMEA based approach to production line/data and system development to insure highly effective but low overhead approach to process capability monitoring. Detail oriented data collection and analysis to enable tool and process validations.

  • Design and implementation of manufacturing systems and documentation for clean transfer into production environment.

  • Interface with and lead integrated teams involving manufacturing and R&D.

  • Development of experiments and methods to identify key relationships between inline parametric data and product functional performance.





All listed tasks and responsibilities are deemed as essential functions to this position; however, business conditions may require reasonable accommodations for additional tasks and responsibilities.





Position Requirements:        



  • Bachelorss degree or equivalent experience in Materials Science, Electrical Engineering, Chemical Engineering or Physics.

  • 5-10 years of industry experience in custom and volume manufacturing environments, experience managing and interfacing with OSAT vendors preferred

  • Experience with MES/manufacturing automation systems

  • Design for Manufacturability (DFM) experience

  • Familiarity with ISO 9001 & ISO 13485 QMS

  • Proficiency with JMP, Excel, Project, SolidWorks, and data mining ability

  • Strong ownership and drive for success

  • Ability and willingness to travel up to 20% of the time

  • Strong communication and documentation skills including qualification plans, work instructions, technician training.





All qualified applicants will receive consideration for employment without regard to race, sex, color, religion, national origin, protected veteran status, or on the basis of disability, gender identity, and sexual orientation.

 

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Posted: 2021-03-17 Expires: 2021-04-16

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Semiconductor Packaging Engineer

Pacific Biosciences
Menlo Park, CA 94025

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